Siemens S7-1500 Communication module, 8xIO-Link, front connector Part number 6ES7547-1JF00-0AB0

Product Overview

The Siemens 6ES7547-1JF00-0AB0 is an IO-Link Master communication module (CM 8×IO-Link) designed for the SIMATIC S7-1500/ET 200MP automation platforms. It provides eight IO-Link ports in one compact module, allowing seamless connection of IO-Link devices and standard sensor/actuator cabling within PROFINET/DP field-bus environments.

Key Features

• 8 IO-Link master channels (IO-Link versions V1.0 & V1.1 supported) for flexible device connectivity
• Supports data transfer rates COM1 (4.8 kB), COM2 (38.4 kB), COM3 (230.4 kB) per port
• Standard DI mode also supported (use with conventional sensors)
• Automatic backup of device parameters for replacement via “master backup” functionality
• Diagnosis and port-level status LEDs (RUN, ERROR, channel status)
• Compact width: 35 mm module width for high-density installation

Technical Specifications

• Product Series: SIMATIC S7-1500 / ET 200MP – CM 8×IO-Link
• Article Number: 6ES7547-1JF00-0AB0
• Supply Voltage: 24 V DC (range 20.4…28.8 V)
• Current Consumption: Max. ~50 mA (no load)
• IO-Link Ports: 8 channels
• Max Process Data Size per Port: Up to 32 bytes input/output
• Max Process Data Size Module-wide: 240 bytes input/output
• Minimum Cycle Time: approx. 2 ms
• Dimensions (H × W × D): 147 mm × 35 mm × 129 mm
• Mounting Width: 2 module units (35 mm)
• Ambient Operating Temperature: –30 °C … +60 °C (horizontal installation)
• Rated Insulation Voltage: 707 V DC (type test)

Compliance & Certifications

• Meets Siemens SIMATIC system quality and diagnostics standards
• Compliant with IO-Link specification plus PROFINET/Profibus connectivity via S7-1500/ET-200MP
• RoHS-compliant design

Applications

The Siemens 6ES7547-1JF00-0AB0 communication module is suited for industrial automation systems requiring compact, flexible IO-Link integration. It enables seamless connection of intelligent IO-Link devices and conventional sensors/actuators to the PROFINET/DP backbone. Typical applications include machine tools, modular assembly lines, packaging systems and distributed automation where high-density I/O and diagnostics are needed.