Siemens Simatic ET 200SP Bundle interface module IM, profinet Part number 6ES7155-6AA02-0BN0

Product Overview

The Siemens 6ES7155-6AA02-0BN0 is a bundled PROFINET interface module for the SIMATIC ET 200SP system (IM 155-6 PN ST). The bundle supports up to 32 ET 200SP I/O modules and up to 16 ET 200AL modules, features multi-hot swap capability and includes essentials like the interface module, a server module and a bus-adapter. It enables efficient integration of distributed I/O into industrial PROFINET networks with redundancy and advanced diagnostics.

Key Features

• PROFINET interface module bundle IM 155-6 PN ST for ET 200SP family
• Supports up to 32 ET-200SP I/O modules and up to 16 ET-200AL modules in a station
• Multi-hot swap capability allows module changes without shutting down the system
• Integrated PROFINET communication with two RJ-45 ports (redundant/machine topology capable)
• Optional strain-relief for PROFINET cables to meet industrial mechanical requirements
• Security class 1 for PROFINET communication

Technical Specifications

• Article Number: 6ES7155-6AA02-0BN0
• Device: Interface Module IM 155-6 PN ST (bundle)
• Supply Voltage (electronics): 24 V DC
• Max I/O Modules per Station: 32 ET 200SP or up to 16 ET 200AL modules
• Interfaces: 2× RJ-45 PROFINET ports, integrated switch
• Protection Class (Front): IP20 (when mounted)
• Operating Temperature Range: −30 °C to +60 °C (horizontal installation)
• Width: 50 mm
• Height: 117 mm
• Depth: 74 mm
• Weight (approx.): 0.12 kg

Compliance & Certifications

• Designed for SIMATIC ET 200SP distributed I/O systems and integration into PROFINET networks
• PROFINET IO-Device certified, supports I&M data levels and multi-hot swap operation
• Manufactured according to Siemens industrial automation standards and RoHS compliant

Applications

This interface module bundle is ideal for automation system integrators, OEMs and machine builders needing a compact and flexible distributed I/O station for PROFINET networks. Typical usage includes modular control panels, distributed automation racks, remote I/O stations and machine modules where up to 32 I/O modules and advanced communication and modular-change capabilities are required.